Liquid Force Bindings
liquid force bindings
The demand for new types of epoxy molding compound semiconductor industry
A molding compound epoxy Selection Process
1.1 Pre-processing block forming material
(1) blocks of pre-formed plastic materials are usually stored in environment 5 ℃ -10 ℃, will have varying degrees of moisture absorption. Therefore, before using a dry place at room temperature room should be expected to wake up, usually not less than 16 hours.
(2) expected higher density of the block. materials in bulk pack may contain too much air and moisture, the rest is not easy material, high frequency and moderate-volatile, will cause higher layer encapsulation device. = "Semi-conductors, microelectronics, integrated circuits, integrated circuits, crafts, design, device, packaging, testing,
(3) The block size should be moderate, is expected to block the bad ones, filling the mold; expects big block, Kai mold problems, contamination by mold and stem injection and caused a serious waste of materials.
1.2 Die temperature semiconductors, microelectronics, integrated circuits, integrated circuits, crafts, design, device, packaging, control, production process, the mold temperature is controlled slightly above the glass transition temperature Tg of molding compounds, they can get better mobility, about 160 ℃ -180 ℃. mold temperature is too high, fast cure plastic material, internal tensions have increased, the encapsulation layer and the framework of the adhesion decreases. At the same time, a polymerization Quick Punch also dissatisfaction; die temperature is too low, low mobility of molding compounds, appear the same mold Junk filling, decreased encapsulation layer strength. While maintaining the mold temperature regions is very uniform important because the non-uniform mold temperature will cause uneven degree of hardening of the plastic, causing the mechanical strength compatible device
Injection pressure = 1.3 "semi-conductors, microelectronics, integrated circuits, integrated circuits, crafts, design, device, packaging, testing, selection of injection pressure, according to the flow of plastic and the temperature the mold can be, the pressure is too small, the device encapsulation layer of low density, poor bonding with the framework, subject to moisture corrosion, and mold are not filled with plastic before curing conditions, the pressure is too large, domestic and lead increases impact force, causing a distortion in the yarn has been washed or washed, and the overflow can be expected, blocking the chimney, resulting in bubbles and fill bad.
1.4 speed injection molding
Select the speed of plastic injection molding based mainly the gel time to identify. gelation time is short injection molding, a little faster, and vice versa. injection molding to be completed before the end of the gel time, or in advance due to hardening caused by plastic thrust or encapsulated in a layer of lead defects.
1.5 Plastic Craft adjust = "semi-conductors, microelectronics, integrated circuits, integrated circuits, crafts, design, device, packaging, tests are given in the production process, as shown in Table 1, the situation, the process conditions may be adjusted appropriately. At process adjustments should also be noted that the storage of materials pre-cast block, cleaning mold, temperature and humidity and other factors environmental impact on the process of Kung plastic.
2 pairs of plastic material properties of the impact of device reliability
2.1 The moisture absorption of the plastic and chemical adhesion to the plastic device, the penetration of moisture influencing their lead to failure of watertight important reasons. moisture infiltration devices are mainly two ways to
(1) through encapsulation layer of plastic body;
(2) by encapsulation layer of plastic and metal frame gap between the two. When the moisture through this in two ways when you reach the surface of the chip in the surface layer of the film water operator, and plastic composite of Na +, CL-ions will also be brought as a potential difference, the speed of the chip surface, corrosion electrochemical aluminum wiring, eventually leading to open circuit wire. With the continuous improvement of integrated circuits, aluminum wiring are becoming smaller and therefore the corrosion of aluminum wiring more serious impact on life expectancy.
In response to these problems, we must ask ourselves: = "Semi-conductors, microelectronics, integrated circuits, integrated circuits, crafts, design, device, packaging, testing,
(1) plastics have a high purity, Na +, CL-ion to a minimum
(2) The main component hardware environment standard epoxy resin and inorganic fillers of the binding must be high to prevent the infiltration of body moisture. , MEMS
(3) plastic with metal frame should have a good grip;
(4) chip passivation layer surface to improve as much as possible, the humidity is also a very good shielding effect
2.2 The internal stresses of plastics
In the plastic, part metal shavings, the linear expansion coefficient mismatch resulting from the internal voltage, the device would have an impact negligible for leaks. Because the expansion coefficient of plastic (20-26E-6 / ℃) than the chip, the frame (-16E-6 / ℃) more cooling of the melt or in the device with the greatest difference in temperature between the environment, it can lead to pressure seal Welding has been torn and broken wire bonding or encapsulation layer and part of the Department, separated from the resulting failure of their devices.
This shows that the plastic expansion linear coefficient of depression to the extent possible, but this reduction is received limited, because in the reduction of stress, while the thermal conductivity of plastics will also be reduced, it is packaging devices for high power very unfavorable, to make these two aspects to consider, depending on the type and amount of the form filling. Filler is generally type of merger or crystalline silica, in some performance requirements may need to add spherical silica fume or vapor.
2.3 The plastic material injection of liquidity when the mold temperature of 160 ℃ -180 ℃, the plastic was molten, its Mobility is essential for the success of the injection, the impact of increased liquidity following the thread (or tensile 5g-12g), the wire tortuous or red can be removed easily, and could easily lead to discontent Punch, the encapsulation layer folds of surface and potholes; liquidity is too high, excess material seriously, if the excess is expected to die prematurely from congestion stomata Online air, quite, the encapsulation layer pores or air bubbles appear.
Various components of the plastic the right to play a major role in mobility is a major epoxy resin melt viscosity and the amount of silica filler and the thickness of the particles. Crystalline silica has a high thermal conductivity, but high viscosity that the heavy flow downward. Fused silica has good mobility, but the low conductivity heat. Therefore, in the century, the production of packaged device performance should be based on the use of different options, including the mixture of both. 3 summarizes the choices for the conditioning process, once we understand the process of encapsulation of several important factors, in the packaging process can be based on different regions, different environment and climate, while the adjustment process differently. Meanwhile, officials of the package should also enhance understanding of epoxy molding compound. About the Author
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US $174.50
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